Rivis also specializes in the production of novel thermal interface materials that have high thermal conductivity and compliance.

Thermal Interface Materials (TIMs): TIMs are used as thermal conductors and heat spreaders to aid in cooling microelectronic devices and packages such as LEDs, high power and high frequency devices, circuit boards, and personal computers. TIMs are necessary to be coupled with thermal electric devices in order to generate electricity from heat sources. Our compliant thermal interface materials are used to protect the fragile thermoelectric ceramics from failure due to the high stresses experienced as a result of the wide temperature excursions experienced during operation of the thermoelectric device to turn wasted heat into energy.

Thermal Compounds: Our thermal compounds have high thermal conductance (>20W/mK) and are easy to apply and use as a paste bonding material.  The thermal compounds can be used in applications which have historically utilized metal filled epoxy but with significantly less time restriction for preparation of the matting surfaces and with higher thermal conductivity.